| 摘要 |
<p>A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insulating substrate. A layer of insulating material having through holes at positions corresponding to the connecting terminals of the electronic element is covered on the wiring conductors. Conductor pedestals for connection with the electronic element are filled in the through holes and formed on the insulating layer. Each of the pedestals has an area for contact with the connecting terminals of the electronic element.</p> |
