Method of and spinning head for spin coating resist onto a wafer.

摘要

This invention relates to a method of spin coating resist onto a wafer 72 and to a spinning head for coating the wafer. The spinning head has a chuck 10 to bo rotated by a spinner motor shaft 14.
<??>The resist is coated onto the wafer 72 through a hole 82 in the centre of an interchangeable top clamp plate 78. The plate 78 is tapered to a knife-edge 86 to seal the top of the wafer and fuide the resist, during spinning, up the tapered surface and off the head. The plate 78 allows certain areas on the wafers such as areas containing registration marks, to be protected from resist coating.