发明名称 |
SEALING METHOD OF ELECTRONIC COMPONENTS |
摘要 |
PURPOSE:To protect each part from external atmosphere surely and to improve the heat dissipation of electronic components, by dropping resin to the electronic components linked to the wiring conductor layer for the electrodes on the wiring substrate and immersing it to the entire surface through exhausting in the vacuum package. |
申请公布号 |
JPS5411696(A) |
申请公布日期 |
1979.01.27 |
申请号 |
JP19770076373 |
申请日期 |
1977.06.27 |
申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
WAKUI KOUICHIROU |
分类号 |
G01S13/82;G01S13/00;H01L21/56 |
主分类号 |
G01S13/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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