| 摘要 |
In the liquid-cooling appliance for cooling a semiconductor component, which has been brought into contact with this appliance, a coolant is introduced through a feeder (3) into a cooling chamber of a base body (2) which is at least partially enclosed by a housing (1), and is passed out again via a discharge (4). In this arrangement, the heat exchange takes place via the base body with which the semiconductor component in question is in contact. Baffles (6 and 8) are employed to induce turbulence in the flowing coolant and thus to achieve considerable heat exchange by avoiding laminar boundary layers. <IMAGE> |
