HEAT DISSIPATION TYPE CONTROLLER AND METHOD OF FABRICATING SAME

摘要

A insulating housing has a recess in which a ceramic substrate is inserted for the first side of the substrate to be inside of the recess and the second side to be exposed and to extend outwardly from the recess slightly beyond the bottom surface of the housing. Clamping the housing against a heat sink compresses the second side of the substrate against the heat sink to enhance heat transfer by reason of the number of junctions or interfaces being minimized. Electric circuit means are disposed on the first side of the substrate and at least one heat generating electric component is in the circuit. A new method and means for connecting leads to the lead frame which is adhered to the substrate is disclosed.