发明名称 METHOD OF MOLDING OR IMPREGNATING RESIN
摘要 For manufacturing molded and impregnated parts from epoxy resin compositions, a reactive epoxy resin is employed which hardens more slowly at higher temperatures (120 DEG to 180 DEG C.) than at lower temperatures (80 DEG to 110 DEG C.). The reactive epoxy resin composition is applied at the higher temperature and subsequently hardened at the lower temperature. According to the method of the invention, molded parts (e.g., solution pump heads), cast-in electrical components (e.g., four-ring stray field electrodes) and impregnated parts are manufactured.
申请公布号 JPS5493068(A) 申请公布日期 1979.07.23
申请号 JP19780104784 申请日期 1978.08.28
申请人 SIEMENS AG 发明人 HANSU DENKU;RAINAA HAABURITSUHI
分类号 B29B15/00;B29C35/18;B29C39/00;B29C39/02;B29C39/38;B29C57/00;B29C70/06;B29K63/00;B29L31/34;C08G59/18;C08J3/24;C08J5/00;C08J5/24;H01B3/40 主分类号 B29B15/00
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