SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

摘要

Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).