| 摘要 |
Heat-resistant resin compns. useful as electronic circuit board were prepd. by mixing 100 parts poly(aminobismaleimide) (I) with 10-300 parts polyepoxy compd. and 5-150 parts copolymer which was selected from >1 copolymer of A) arom. vinyl compd. -maleic anhydride copolymer, B) ester compd. of A,C) arom. vinyl compd. -maleic acid alkyl ester copolymer, D) arom. vinyl comd. -maleic anhydridemaleic acid alkyl ester terpolymer.
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