发明名称 ELECTROFORMING MOLD, ELECTROFORMING MATRIX, AND METHOD FOR MANUFACTURING ELECTROFORMING MATRIX
摘要 PROBLEM TO BE SOLVED: To provide an electroforming mold which enables a post-process such as polishing by integrally removing electroformed bodies without removing one by one from an electroforming mold, in an electroforming component producing electroforming mold for producing a plurality of electroforming components at the same time, transferred and copied onto a resin plate by compression/heating, and formed with electroforming conductive films on the surface, an electroforming matrix for producing the electroforming mold, and a method for manufacturing the electroforming matrix.SOLUTION: An electroforming matrix is for transferring to an electroforming mold which has electroforming component-shaped recesses 205 to be a plurality of electroforming component bodies, similarly shaped recesses 207 formed thereon so as to open the recesses 205, including an outer shape of the electroforming component-shaped recess 205, and having a shape larger than the outer shape, and connection recesses for connecting the similarly shaped recesses 207. The recesses are formed with conductive films, and electroforming is performed into the recesses by the conductive films so as to give electroforming bodies in a state that the plurality of electroforming component bodies are connected, and precise electroforming components having no defect such as junction trace in electroforming are produced by passing the electroforming bodies through a post-process such as polishing.SELECTED DRAWING: Figure 2
申请公布号 JP2016176090(A) 申请公布日期 2016.10.06
申请号 JP20150055152 申请日期 2015.03.18
申请人 SEIKO INSTRUMENTS INC 发明人 KISHI MATSUO;NIWA TAKASHI;SATO MIE
分类号 C25D1/10;C25D1/00 主分类号 C25D1/10
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