摘要 |
<p>The panels or tiles etc. are used to cover walls, floors, ceilings etc., and consist of a moulding onto which a carrier layer is applied. The carrier layer is then heated and covered by a layer of enamel which is immediately melted. The enamel layer is pref. applied and melted via flame spraying; and layers are pref. heated via infrared (IR) rays. Carrier layer pref. contains 10% polymer, silicate, nitrocellulose, or phenol as a binder, and 90% metal and/or enamel particles; and is applied by painting or spraying in a hot or cold state onto the moulding; and enamle layer is pref. an enamel with a low m.pt. The moulding is pref. a low carbon silicate-resin mixt.; and carrier layer is pref. heated to 400-600 degrees C before applying enamel layer. Provides a simple and inexpensive enamelling process to replace enamels which must be baked in a furnace for up to 16 hours and is therefore very costly.</p> |