发明名称 Semiconductor device with heat sink - using a good heat conductor to mount the device on the sink
摘要 <p>Button semiconductor device is mounted on a heat sink via a member of good thermal condictivity. The high heat conductivity material can be an insulator e.g. aluminium oxide or silicone oil, or a further semiconductor device, e.g. a further rectifier device of a bridge or polyphase rectifier arrangement or a reverse biased diode.</p>
申请公布号 DE2838412(A1) 申请公布日期 1980.06.19
申请号 DE19782838412 申请日期 1978.09.02
申请人 ROBERT BOSCH GMBH 发明人 RAGALY,ISTVAN,DIPL.-ING.
分类号 H01L23/049;H01L23/31;H01L23/34;H01L23/373;H01L25/04;H01L25/07;H02M7/00;(IPC1-7):01L25/02;01L23/36 主分类号 H01L23/049
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