发明名称 |
Soldering together two elements arranged on opposite sides of a substrate |
摘要 |
<p>In an arrangement wherein first and second elements (e.g. of copper) arranged on opposite sides of a substrate (e.g. electronically insulating) are provided with respective adjoining parts which are connected together by connecting means passing through a hole formed in the said substrate, the part (31a) of the first element (31) blocks the hole (35), (35) in the substrate (33), whilst the part (32a) of the second element (32) is fixed in solder (36) which at least partly fills the said hole and which forms the said connecting means (34). The solder may be introduced into the hole in paste form by screen printing and remelted by hot gas. An electrically heated bit may deform the second element part (32a) into the solder while melting the latter. <IMAGE></p> |
申请公布号 |
GB2036624(A) |
申请公布日期 |
1980.07.02 |
申请号 |
GB19790029888 |
申请日期 |
1979.08.29 |
申请人 |
COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWE |
发明人 |
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分类号 |
F16B5/08;B23K3/03;B23K3/047;H05K1/11;H05K3/34;H05K3/40;(IPC1-7):23K1/12 |
主分类号 |
F16B5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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