| 摘要 |
A process for fusion-bonding of resins, which comprises applying a layer of thermoplastic resin having a light transmittance lower than 20% and a melting point of 40 DEG to 250 DEG C. to a substrate and fusion-bonding the resin layer to the substrate by emission energy of a flash discharge lamp. The electric input energy J (joule) of the flash discharge lamp is controlled relative to the weight of the resin layer.
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