发明名称 ALUMINUM ALLOY COMPOSITE MATERIAL FOR SOLDERING
摘要 PURPOSE:To prevent corrosion of a core material by interposing an Al alloy contg. one or more out of Zn, Sn, In, Bi and Sb between an Al-Si type solder and the core material to prevent diffusion of Si and provide a sacrificial anode function to the solder. CONSTITUTION:An Al alloy contg., by wt., one or more out of Zn 0.5-4.0%, Sn 0.01-1.0%, In 0.01-0.1%, Bi 0.01-1.0% and Sb 0.01-1.0% is interposed between an Al-Si type solder and a core material in a thickness of 20-100% to the thickness of the solder. This Al alloy layer acts as a layer for preventing diffusion of Si in the solder, and it controls diffusion shifting of the Si toward the core material. In addn., this layer is unified with the solder in a soldering process, whereby the sacrificial anode providing element contained in the layer diffusion- shifts into the solder to assuredly prevent corrosion of the core material.
申请公布号 JPS55104452(A) 申请公布日期 1980.08.09
申请号 JP19790011117 申请日期 1979.02.01
申请人 KOBE STEEL LTD 发明人 UMIBE SHIYOUJI;YAGI INEKI;FUJIMOTO HIDEO;TAKIGAWA ATSUSHI
分类号 C22C21/00;B23K35/22;B23K35/28;B32B15/01;C23F13/00;F28F21/08 主分类号 C22C21/00
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