Process for fusion-bonding of resins

摘要

A process for fusion-bonding of resins which comprises applying a layer of thermoplastic resin having a light transmittance lower than 20% and a melting point of 40 to 250 DEG C. to a substrate and fusion- bonding the resin layer to the substrate by emission energy of a flash discharge lamp. The electric input energy J (joule) of the flash discharge lamp is controlled relative to the weight of the resin layer.