| 摘要 |
PURPOSE:To easily position a cap with strong mechanical pressure resistance in a FAX or ultraviolet ray erasable EPROM semiconductor container by seam welding a window frame-like cap sealed with ultraviolet ray transmission glass through first sealing glass at a throttle hole having an oblique shape. CONSTITUTION:A chip 3C is secured to a mount 3C of a ceramic substrate 1C, the electrode of the chip 3C is connected to an external lead wire 6C through an electric wire 7C and a bonding pad 4C, and a sealing frame 8C is soldered thereto. A window frame-like cap 9C having a first throttle 10C confronting the inside of a package and a second throttle 16C confronting the center from the first throttle 10C in the same plane and opened outwardly of the package on the way thereto is seam welded to the sealing frame 8C. Ultraviolet ray transmission glass 15C is sealed through borosilicate glass 14 to the wall 13C of the opening. |
