摘要 |
<p>The arrangement is intended for producing a panel (2), partic. a chipboard panel, for covering a wall, which panel is provided with a bonded pattern of brick courses (4) applied with the aid of a template (5) so as to obtain the distances between the joints. The panel is first provided with a coloured layer (3) which simulates the mortar in the joints, and thin strips of simulated brick (4) whose thickness equals the usual depth of the joints, i.e. around 4 mm, are cast on to this layer using the template. These strips set as they dry and adhere to the panel.</p> |