发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To justify economically the soldering of the lead wires, by covering the surface of the outer lead wires with anti-oxidation film which can be dissolved and sublimated at the temperature suitable for soldering. CONSTITUTION:The oxidized substances on the surface of the lead wire are removed. After the lead wire is immersed in the preliminarily prepared solution for surface treatment, it is dried by heating. By these treatments anti-oxidation film is formed on the surface, and the active surface of the wire is protected and maintained. This film can be dissolved and sublimated at the temperature suitable for soldering. Therefore there is no difficulty in justifying the soldering economically.</p>
申请公布号 JPS5698849(A) 申请公布日期 1981.08.08
申请号 JP19800000990 申请日期 1980.01.08
申请人 发明人
分类号 H01L23/48;(IPC1-7):01L23/48 主分类号 H01L23/48
代理机构 代理人
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