| 摘要 |
<p>PURPOSE:To increase the strength of the substrate, by making grooves around the part from within which the semiconductor chips are obtained in a manner that the groove does not border on the neighboring ones. CONSTITUTION:With the usual size and arrangement of the part 3, the circular groove 2a is prepared around it so that it does not border on the neighboring circular groove. In this manner the substrate does not break during the preparation and the better yield can be obtained in the form of hexagonal chips by cutting the line 4 after the preparation finished.</p> |
