3D device packaging using through-substrate pillars

摘要

A method for 3D device packaging utilizes through-substrate pillars to mechanically and electrically bond two or more dice. The first die includes a set of access holes extending from a surface of the first die to a set of pads at a metal layer of the first die. The second die includes a set of metal pillars. The first die and the second die are stacked such that each metal pillar extends from a surface of the second die to a corresponding pad via a corresponding access hole. The first die and second die are mechanically and electrically bonded via solder joints formed between the metal pillars and the corresponding pads.

主权项

1. A method comprising:
stacking a first semiconductor die with a second semiconductor die, the first semiconductor die comprising a first set of access holes extending from a first surface of the first semiconductor die to a first set of pads at a metal layer of the first semiconductor die and the second semiconductor die comprising a first set of metal pillars, each metal pillar of the first set of metal pillars extending from a surface of the second semiconductor die to a first surface of a corresponding pad of the first set of pads via a corresponding access hole of the first set of access holes; and bonding the first semiconductor die and the second semiconductor die such that the metal pillars of the first set of metal pillars are in electrical contact with the corresponding pads of the first set of pads.