| 摘要 |
The present disclosure describes a multi-layered integrated circuit package especially suited for high density circuit applications, such as those involving LSI or ULSI. The package is characterized by short uninterrupted electrical circuit paths between the integrated circuit chip and an interconnection medium. The use of metallized vias or feed-throughs commonly employed in multi-layered packages have been eliminated. Also, heat dissipation is enhanced by the short thermal path between the chip and the outer package surface. Finally, the signal lead configuration permits the area occupied by the package on the interconnection medium to be significantly less than that of present-day packages having approximately the same number of input/output pins or terminals.
|
