| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to activation of dielectric surface before chemical and/or electrochemical metal coating and can be used to make high-density multilayer printed circuit boards with direct metal coating of through and blind holes with finishing with coatings for lead-free technology at high temperature soldering. Method involves degreasing and pickling a workpiece, its treatment for 5-6 minutes in an activation solution heated to 40-45 °C, containing components in following ratio, wt%: palladium dichloride - 0.015-0.03, tin dichloride dihydrate - 3.5-4.5, sodium chloride - 0.4-1, aluminium trichloride - 0.01-0.03, vanillin - 0.2-0.4, water - balance.EFFECT: invention provides an optimum level of adhesion of surface of dielectric materials with metal coating, reduced duration of technological cycle of direct metal coating and higher reliability at reduced cost of obtained product.1 cl, 1 tbl, 1 ex |
