DEVICE FOR APPLYING SOLDER TO PRINTED CIRCUIT BOARDS AND A PROCESS FOR INTRODUCING THESE INTO,AND REMOVING THEM FROM,THIS DEVICE

摘要

A printed circuit board solder leveling device comprising guides distributed across the width of the soldering bath container. Each guide comprises opposed guide rods spaced apart a distance greater than the thickness of a printed circuit board so that there is loose contact only of the guides with opposite sides of the board.