| 发明名称 |
VERFAHREN ZUR AUSFUEHRUNG VON DRAHTVERBINDUNGEN MIT KONTAKTFELDERN VON HALBLEITERELEMENTEN UND INTEGRIERTEN SCHALTUNGEN |
| 摘要 |
<p>The method of connecting wire to contact banks of semiconductor components and integrated circuits comprises thermocompression as a result of the impact of a tool having a mass of 0.5 to 5 g. The impact deforms the wire or the sphere and is followed by a static tool pressure lasting 5 to 30 ms which brings about a permanent joining of the components.</p> |
| 申请公布号 |
DD157032(A5) |
申请公布日期 |
1982.10.06 |
| 申请号 |
DD19810227057 |
申请日期 |
1981.01.16 |
| 申请人 |
PRZEMYSLOWY INSTYTUT ELEKTRONIKI,PL |
发明人 |
MAJEWSKI,BOHDAN,PL;BUZA,JERZY,PL |
| 分类号 |
B23K11/10;B23K20/00;H01L21/603;(IPC1-7):H01L21/60 |
主分类号 |
B23K11/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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