| 摘要 |
<p>The thin layered electronic circuit comprises a substrate (1) of insulating material and a resistive layer (2) partially coveringthe substrate. The resistive layer (2) forms a first pattern (M1) defining conductor tracks and/or connection contacts, and a second pattern (M2) which defines circuit elements of the thin layered electronic circuit. In the first pattern (M1) there is arranged, on top of the resistive layer (2) a metal layer (3) which is brazable and maybe reinforced by galvanizing. On a portion of said metal layer (3), inside the first pattern (M¿1), there is applied a soft brazing layer (8) for the formation of conducting tracks and/or connection contacts reinforced by soft brazing. On the other portion of the metal layer (3) which is not covered with soft brazing, there is applied a gold layer (6, 61) inside the first pattern (M¿1?) for deformation of conducting tracks and/or connection contacts reinforced by gold. On the gold layer (6), a connection wire (63) is fixed.</p> |
