Method for determining photomask alignment.

摘要

This describes a method for electrically evaluating the overlay error of a photolithographic tool. In this process a reusable substrate (10) bearing a fixed reference mark (15) has a photolithographic tool defined metal liftoff pattern (17) formed thereon to provide a pair of conductive lines (20a, 20b) by measuring the relative resistance of the lines with respect to one another the alignment of the tool defined pattern with regard to the reference mark (15) may be determined and thus the overlay error of the tool established.