| 摘要 |
Properties of the surface of low melting substrate parts including low melting, high conductivity reactive metal parts, are modified by forming an alloy casing thereon having the metal of the substrate as a first (matrix) component thereof together with a higher melting material as the second (reinforcing) component. The higher melting component is coated on the substrate, melted under laser heating, with gas shielding to avoid oxidation, and mixed with a melted portion of the substrate through convective circulation and the mixture is rapidly cooled to produce the alloy casing. Then the casing may be rescanned with the laser beam to rapidly melt and resolidify the casing with refined grain structure. Such grain refining may also be applied to uncoated substrates.
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