| 摘要 |
An Electronics Package for providing a low cost enclosure of good esthetic and functional character. The package is formed from an extrusion, preferably a plastic extrusion, having one or more pairs of slots on the inner surface thereof for receiving and supporting the edges of a printed circuit board. End caps on each end of the extrusion complete the enclosure with the end caps being retained in place by any of a variety of techniques. By fastening the printed circuit board or printed circuit boards to at least one of the end caps, no other circuit board retention within the central extruded section is required. The end caps may be configured so as to have openings to expose or make accessible switches, connectors and the like mounted on the printed circuit board or boards, or to provide access for an edge connector for connecting directly to the printed circuit board. Various embodiments are disclosed, including embodiments for packaging of modems and further including modem packages having adjustable muff spacing.
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