| 摘要 |
PROBLEM TO BE SOLVED: To enable precise positional correction at the time of packaging by using position recognition marks, even if a substrate is complicatedly deformed. SOLUTION: In a packaging method wherein position recognition marks A, B, C, D on a substrate 2 are observed by a camera for recognizing respective positions so that an electronic component may be packaged on the substrate 2 by correcting program data according to the results of the recognition. The positional correction amounts of packaging coordinates are computed for the entive set of combinations, first at least for three points (e.g. A, B, C) out of four points of the recognition marks A, B, C, D according to the coordinate data on three points before and after the deformation of the substrate 2 (according to design data and recognized data) at the time of packaging). The means values of the positional correction amounts of the whole combination are regarded as the actual positional correction amounts Δxm, Δym, and the program data of the packaging coordinates are corrected by these positional correction amounts. |
