发明名称 |
Inline measurement of molding material thickness using terahertz reflectance |
摘要 |
A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector. |
申请公布号 |
US9508610(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201414499120 |
申请日期 |
2014.09.27 |
申请人 |
Intel Corporation |
发明人 |
Liu Shuhong;Ghosh Nilanjan Z.;Wang Zhiyong;Goyal Deepak;Gokhale Shripad;Zhang Jieping |
分类号 |
H01L21/66;G01B11/06;H01L23/31;H01L23/00 |
主分类号 |
H01L21/66 |
代理机构 |
Blakely, Sokoloff, Taylor & Zafman LLP |
代理人 |
Blakely, Sokoloff, Taylor & Zafman LLP |
主权项 |
1. A method comprising:
emitting a terahertz beam from a light source at a layer of molding material comprising an organic resin on an integrated circuit substrate, wherein terahertz light can penetrate each of the molding material and the substrate producing a first reflectance at an air/molding material interface, a second reflectance at a molding material/substrate interface and a third reflectance from the substrate; detecting the second reflectance of the beam with a time delay; and determining a thickness of the layer of molding material. |
地址 |
Santa Clara CA US |