发明名称 Inline measurement of molding material thickness using terahertz reflectance
摘要 A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.
申请公布号 US9508610(B2) 申请公布日期 2016.11.29
申请号 US201414499120 申请日期 2014.09.27
申请人 Intel Corporation 发明人 Liu Shuhong;Ghosh Nilanjan Z.;Wang Zhiyong;Goyal Deepak;Gokhale Shripad;Zhang Jieping
分类号 H01L21/66;G01B11/06;H01L23/31;H01L23/00 主分类号 H01L21/66
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. A method comprising: emitting a terahertz beam from a light source at a layer of molding material comprising an organic resin on an integrated circuit substrate, wherein terahertz light can penetrate each of the molding material and the substrate producing a first reflectance at an air/molding material interface, a second reflectance at a molding material/substrate interface and a third reflectance from the substrate; detecting the second reflectance of the beam with a time delay; and determining a thickness of the layer of molding material.
地址 Santa Clara CA US