发明名称 |
Chip resistor and electronic device |
摘要 |
[Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1. |
申请公布号 |
US9508473(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201214366092 |
申请日期 |
2012.12.10 |
申请人 |
ROHM CO., LTD. |
发明人 |
Yoneda Masaki |
分类号 |
H01C1/012;H01C1/142;H01C7/00;H01C17/02;H01C17/28 |
主分类号 |
H01C1/012 |
代理机构 |
Hamre, Schumann, Mueller & Larson, P.C. |
代理人 |
Hamre, Schumann, Mueller & Larson, P.C. |
主权项 |
1. A chip resistor comprising:
a base including a principal surface; a first principal surface electrode formed on the principal surface; a second principal surface electrode formed on the principal surface and spaced apart from the first principal surface electrode in a first direction; a resistor element formed on the principal surface and held in contact with the first principal surface electrode and the second principal surface electrode; an overcoat covering the resistor element, the first principal surface electrode and the second principal surface electrode; a first auxiliary electrode covering the first principal surface electrode and the overcoat; and a first plating electrode covering the first auxiliary electrode; wherein the first auxiliary electrode includes a portion offset from the first principal surface electrode in the first direction, and the overcoat and the first auxiliary electrode include a flat overcoat obverse surface and a flat auxiliary electrode obverse surface, respectively, that are flush with each other. |
地址 |
Kyoto JP |