| 摘要 |
A leadless package 1 has a plurality of ceramic substrates 5, 5 min , 5 sec , 5''' laminated together. The package has an internal bonding pad 8, from which a wire is connected to a circuit pad of a semiconductor chip mounted in the package 1 and an external terminal pad 3 to which the bonding pad 8 is electrically connected by way of conductive parts on internal surfaces 16 of through holes in substrates 5,5 min and 5 sec , by way of connecting pads 13 on the surfaces of the substrates, and by way of a conductive layer 10 on the surface of a notch in the edge of the substrate 5''' on which the terminal pad 3 is provided. |
