| 摘要 |
A solvent-less non-aq. compsn. comprises (a) solid bisphenol A epoxy resins having an EEW of 400-8000, a Durran's softening pt. of at least 70≦̸C and less than 30 OH gps. per molecule; (b) 5-40 phr. solid polyanhydride curing agent at least 50 mole % of which is trimellitic anhydride; (c) 0.01-1 phr. cross-linking agent R3SnX (where each R is independently alkyl, aryl, ralkyl or alkaryl of up to 20 C and X is acetate, propionate, butyrate, halogen or OH); (d) 0.01-5 phr. accelerator; (e) 0.1-5 phr. activator selected from catechol, pyrogallol, phloroglucinol or their mixts.
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