Soldering apparatus.

摘要

An apparatus for soldering printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path. The apparatus has a nozzle member (7) from which a first molten solder is forced to overflow to form a wave (19) of overflowing solder extending in the direction of the path of travel of the printed circuit board (20) so that the lower side of the printed circuit board (20) is brought into co-current contact with the upper surface of the solder wave (19) for effecting both preheating and first soldering treatment by the first molten solder. Another solder applicator (2) is provided adjacent to and downstream of the nozzle member (7) to effect a second soldering treatment by a second molten solder.