| 摘要 |
A plastic package for radiation sensitive electrically programmable read-only memory devices is disclosed. A "slug" of ultraviolet transmissive material, such as fused quartz, sapphire, or other suitable material is bonded to the radiation sensitive surface of the semiconductor chip. The chip is wire bonded and die attached in the conventional manner, and is then encapsulated within a shell using existing epoxy techniques. The slug is shaped such that its upper surface is not covered during the encapsulating process, and thus ultraviolet radiation can penetrate through the slug and be diffused onto the chip thereby erasing the memory cells.
|
