| 摘要 |
Precision machine for transferring small components onto a support. The machine of the invention comprises a hollow positioning arm 10 connected to a vacuum pump 14 and to a vertical-displacement device 15. The component 26 to be treated is seized by suction. An ultrasound source 18 is connected to the arm 10. A heating device 30, which has a low time constant for rise and fall in temperature, is thermally connected to a base plate 22 and means are provided for linear and angular relative displacements of the end of the arm with respect to the base plate. Application to the mounting of semiconductor lasers. <IMAGE>
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