| 摘要 |
<p>Polyimides represented by general formula (I), (wherein Ar1 and Ar2 each represents an aromatic ring-containing group, Cf represents a fluorinated alkyl group directly bound to Ar1, and m > 1), and polyamic acids as their percursors. The polyimides have excellent humidity resistance and heat resistance, thus being useful as coating materials for semiconductor chips and insulating films for multi-layered wiring. </p> |
