Shot arranging method in a divisional printing apparatus

摘要

In a divisional printing apparatus wherein the pattern of a mask is reduced and projected for printing onto a wafer and the mask and the wafer are moved relative to each other at each shot so that the exposed areas thereof do not overlap each other, and whereby the same pattern as that for collective printing is printed onto the effective area of the wafer by a plurality of shots, a shot arranging method in which, in the case of a so-called multichip shot in which a plurality of chips are exposed at a time at each shot, the special chip area of the wafer is not exposed, but the wafer is effectively exposed so that the creation of unusable chips is minimized.