| 摘要 |
PROBLEM TO BE SOLVED: To secure thermal contact from an electronic component to a heat receiving member to absorb a gap tolerance even when a designed gap between the electronic component and the heat receiving member is narrow.SOLUTION: An electronic apparatus 22 includes: a move member (shield member 46), movable in a direction along a substrate 40 by receiving heat from an electronic component 42 on the substrate 40; and a heat receiving member (screen rear plate 34), for receiving heat from the move member. Inclined members 52 and 54, including inclined surface 52S and 54S, inclined to the substrate 40 at portions respectively facing the move member and the heat receiving member, are provided.SELECTED DRAWING: Figure 4 |
