| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of suppressing generation of by-products without using a complicated device.SOLUTION: In a reaction chamber 4 of a semiconductor manufacturing device, a semiconductor substrate 7 is placed. Reaction gas is supplied into the reaction chamber 4 to process a surface of the substrate, and simultaneously, other gas is mixed and reacted with unreacted gas that passed through the reaction chamber 4, at a downstream side of the reaction chamber 4. By the mixed gas, by-products that are likely to be sublimated even at a low temperature are produced, and then, removed by a normal air exhaustion step.SELECTED DRAWING: Figure 1 |
