IC socket with IC package pressing means

摘要

An IC socket with IC package pressing means comprises a socket substrate, an IC package pressing plate having one end thereof pivotally link-connected to one end of the socket substrate, and an operative lever having one end thereof pivotally link-connected to the other end of the IC package pressing plate and provided with engaging claw pieces which collide against the other end of the socket substrate, lead the IC package pressing plate and the operative lever to their respective laid-down positions relative to the socket substrate and engage with the aforementioned other end of the socket substrate.