发明名称 Complex probe card for testing a semiconductor wafer
摘要 A probe card includes a printed circuit plate having an aperture at the center thereof and a ring fixed around said aperture on either side of the plate. The ring is adapted to support probe needles in radial arrays with respect to the aperture. Each of the arrays has a multilayer of probe needles which have their terminal tips aligned on a plane in parallel with the plate and their opposite terminal ends connected to the printed circuit for external connection.
申请公布号 US4523144(A) 申请公布日期 1985.06.11
申请号 US19810266054 申请日期 1981.05.21
申请人 JAPAN ELECTRONIC MATERIALS CORP. 发明人 OKUBO, MASAO;YOSHIMITSU, YASURO
分类号 G01R1/073;(IPC1-7):G01R1/06;G01R31/02 主分类号 G01R1/073
代理机构 代理人
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