发明名称 |
Apparatus and method for heating objects EG chips during soldering, to and maintaining them at a desired temperature. |
摘要 |
<p>An improved apparatus and method are disclosed for heating objects, such as electronic chips being bonded to substrates, in which a copper heat exchanger element (12) comprises a circuitous interior passage (26) through which gases pass from a source (30) to be heated by a heater (74) to a desired temperature and to be cleansed of unwanted oxygen by catalytic reaction, prior to entering a furnace chamber (22) heated from below by the heat exchanger element (12) and from above by a further heater (72) and copper plate (60), whereby essentially uniform gas temperature, acceptably low oxygen concentration and fast cycling times are provided in the furnace chamber (22).</p> |
申请公布号 |
EP0145975(A1) |
申请公布日期 |
1985.06.26 |
申请号 |
EP19840113864 |
申请日期 |
1984.11.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MACINNES, ROBERT DONALD;PERIU, CARLOS CESAR;ROHR, ROBERT LEWIS |
分类号 |
H05K3/34;B23K1/008;B23K1/012;B23K31/02;F27D7/06;(IPC1-7):B23K3/04 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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