发明名称 Thermal cut-off device
摘要 A thermal cut-off device comprises a casing and a cover therefor both made of a highly heat conductive electrically insulating material such as ceramic. A pair of lead wires protrude from opposite ends of the casings with the other ends of the wires being electrically connected to an electrical assembly within the casing. The electrical assembly comprises a leaf spring, a conductive fixed terminal and a plastic mass for biasing the leaf spring so as to contact the fixed terminal during closed circuit condition. A helical spring in the casing stabilizes the leaf spring upon its release when the plastic mass melts due to overheating.
申请公布号 US4527144(A) 申请公布日期 1985.07.02
申请号 US19830550001 申请日期 1983.11.08
申请人 SOC CORP TOKYO 发明人 ARIKAWA, HIROO
分类号 H01H1/06;H01H37/76;(IPC1-7):H01H37/76 主分类号 H01H1/06
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