Polyamic acid copolymer solutions for improved semiconductor manufacturing.

摘要

A polyamic acid copolymer forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline is disclosed. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.