| 摘要 |
PURPOSE:To reduce the cost and eliminate the possibility of wire cuts by unnecessitating the wire molding after bonding, by a method wherein wires are molded by wiring along the upper surface of a hollow contraction body. CONSTITUTION:The hollow contraction body 10 made of elastic rubber is set up between chip components 2 and 3, and the upper thin shell 12 is swelled in a form of semi-cylinder by blowing air into the hollow part 11 through an air injection port 13. Using a bonding capillery 5, the tip of a wire 4 is bonded to the electrode of the chip component 2. While the wire 4 is led out of a guide hole 7, this wire 4 is wired by being molded in a form of semi-cylinder by making the capillery 5 run along the upper surface of the upper thin shell 12 of the hollow contraction body 10; thus, the wire 4 is bonded to the electrode of the chip component 3. Thereafter, the hollow contraction body 10 is led out by recessing the upper thin shell 12 under reduced pressure of the air of the hollow part 11. |
