| 摘要 |
Provided is a device assembling method. The method comprises: providing a groove (51), for accommodating a device, on a metal substrate (50). The method further comprises: providing a tin storage tank (52) on the outer side of the groove (51), the tin storage tank (52) being deeper than the groove (51); placing, when a device (70) needs to be welded, the device (70) in the groove (51), and placing soldering tin between the device (70) and the groove (51); and welding the device (70) into the groove (51) by means of a welding process. Also provided is a circuit board. The device assembling method can reduce the welding voidage, reduce the sensitivity on a pressure point position, a furnace temperature and other influencing factors caused by welding quality, reduce the non-determinacy of the welding quality, improve the consistency of products, further guarantee a grounded effect and a performance requirement of a power tube on the basis of guaranteeing the welding voidage of the power tube, and reduce the unqualified welding rate of a power amplifier tube, thereby reducing the production cost and improving the production efficiency. |
