| 摘要 |
The invention relates to a method for curing at least in part a photoresist applied to a substrate, in which the following steps are carried out. The substrate coated with the photoresist is arranged on a support. The photoresist is subjected to a suitable temperature for curing the photoresist for a first predetermined time period. After the first predetermined time period has passed, the substrate is rotated and subjected to a suitable temperature for curing the photoresist for a second predetermined time period. The invention also relates to a device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in the chamber and on which the substrate can be arranged, and a device for rotating the substrate between a first and a second phase of the curing of the photoresist. |
