| 摘要 |
<p>A composition for use in electroless plating of ceramics, which contains: (i) one part by weight of at least one compound selected from among organo-palladium and organosilver compounds; (ii) 0.1 to 200 parts by weight of at least one organo-metallic compound; (iii) 10 to 1,000 parts by by weight of an organic solvent; and, if necessary, (iv) 1 to 500 parts by weight of at least one compound selected from among high molecular compounds and inorganic powders.</p> |
