发明名称 |
WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME |
摘要 |
An integrated circuit includes a monitoring circuit and a monitored circuit connected with the monitoring circuit. The monitoring circuit is operable to determine during fabrication if a resistance of a connection between an in-fab redistribution layer connector and a post-fab redistribution layer connector exceeds a threshold. |
申请公布号 |
HK1187149(A1) |
申请公布日期 |
2016.12.30 |
申请号 |
HK20130114396 |
申请日期 |
2013.12.30 |
申请人 |
BROADCOM CORPORATION |
发明人 |
Hu, Kunzhong;Zhong, Chonghua;Law, Edward |
分类号 |
H01L |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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